Manufacturing test development
- Pre-silicon development of tests for use in manufacturing, supporting
- Structural tests such as scan, BIST, etc
- Functional system-level tests to complement structural tests.
- Field operational tests
- Many safety-related applications (such as automotive) demand testing during operation to detect faults.
- Such tests have strict coverage and time-to-run targets met through a mix of structural and functional tests.
OSAT
- Outsourced Semiconductor Assembly and Test (OSAT) refers to specialised third-party companies that handle the crucial final stages of semiconductor manufacturing: packaging bare chips (dies) into protective casings and testing them for quality and functionality before they reach consumers, thus bridging the gap between manufacturing and final product.
- We offer expertise, cost efficiency, reliable supply chains, and faster time-to-market by handling complex tasks like wire bonding, flip-chip bonding, moulding, and final quality checks for various chip packages (BGA, QFN, etc.), allowing you to focus on your core competencies.
